A Zen 3 CCD is composed of a single core complex (CCX) containing 8 CPU cores and 32 MB of shared 元 cache, this is in contrast to Zen 2 where each CCD is composed of 2 CCX, each containing 4 cores each as well as 16 MB of 元 cache.
Like Zen 2, Zen 3 is composed of up to 2 core complex dies (CCD) along with a separate IO die containing the I/O components. Zen 3 is a significant incremental improvement over its predecessors, with an IPC increase of 19%, and being capable of reaching higher clock speeds. On April 20, 2022, AMD also released the Ryzen 7 5800X3D desktop processor, which increases the single threading performance by another 15% in gaming by using, for the first time in a PC product, 3D vertically stacked 元 cache. On April 1, 2022, AMD released the new Ryzen 6000 series for the laptop, using an improved Zen 3+ architecture. According to AMD, Zen 3 has a 19% higher instructions per cycle (IPC) on average than Zen 2. Zen 3 is the last microarchitecture before AMD switched to DDR5 memory and new sockets, which are AM5 for the desktop "Ryzen" chips alongside SP5 and SP6 for the EPYC server platform. Zen 3 is supported on motherboards with 500 series chipsets 400 series boards also saw support on select B450 / X470 motherboards with certain BIOSes. Zen 3 powers Ryzen 5000 mainstream desktop processors (codenamed "Vermeer") and Epyc server processors (codenamed "Milan"). It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. Zen 3 is the codename for a CPU microarchitecture by AMD, released on November 5, 2020.
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